Plastic-Metals Technologies provides your sophisticated electronic enclosures with real product advantages through our unique thin-film metallization process. In basic terms, we apply thin layers of metal onto plastic, glass and ceramics to add electronic shielding, reflectivity, cosmetic and optical enhancements. The specifications below are based on applying our standard metals to typical surface textures.

Specifications

• 0.1 to 0.20 Ohms/square uniform impedance;
• Uniform coating on complex substrates (plastics, metals, ceramics, glass);
• >4B adhesion (ASTM D 3359-93);
• Temperature to 65 degrees centigrade @ 95% humidity with temperature cycling resistance (UL 746C);
• Thin, uniform metal plating supporting accurate assembly;
• Precision masking allows selective plating;
• There is no environmental impact or VOCs during the process;
• Process repeatability;
• Custom coatings available to meet your specific needs;
• Parts size can be up to 70 inches long and 18 inches wide; no limit on how small parts can be;
• Production capacity - process up to 11,520 sq. ft. of thin-film metallization area per month.

Available Coatings

Aluminum/Copper

• Provides conductive layer with oxidation and corrosion resistance;
• Most effective and efficient EMI/RFI solution.

Nickel/Copper

• Provides conductive layer with oxidation, corrosion and wear resistance;
• Provides an excellent paint base.

Stainless Steel Only

• Best for ESD; has a high resistivity;
• Less costly than Copper.

Stainless Steel/Copper

• Best for ESD and EMI/RFI combined.

Copper Only

• Provide low-impedance conductive coating.

Aluminum Only

• Reflective coatings and cost-effective conductive coating.

Other Metals or Alloys, as requested