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Plastic-Metals Technologies provides your sophisticated electronic
enclosures with real product advantages through our unique thin-film
metallization process. In basic terms, we apply thin layers of metal onto
plastic, glass and ceramics to add electronic shielding, and electrostatic
discharge protection. The specifications below are based on applying our
standard metals to typical surface textures.
Specifications
- 0.1 to 0.20
Ohms/square uniform impedance;
- Uniform coating on
complex substrates (plastics, metals, ceramics, glass);
- >4B adhesion
(ASTM D 3359-93);
- Temperature to 65
degrees centigrade @ 95% humidity with temperature cycling resistance
(UL 746C);
- Thin, uniform metal
plating supporting accurate assembly;
- Precision masking
allows selective plating;
- There is no
environmental impact or VOCs during the process;
- Process
repeatability;
- Custom coatings
available to meet your specific needs;
- Parts size can be up
to 70 inches long and 18 inches wide; no limit on how small parts can
be;
- Production capacity
- process up to 11,520 sq. ft. of thin-film metallization area per
month.
- ISO 9001: 2000 Certified
Available
Coatings
Aluminum/Copper
- Provides conductive
layer with oxidation and corrosion resistance;
- Most effective and
efficient EMI/RFI solution.
Nickel/Copper
- Provides conductive
layer with oxidation, corrosion and wear resistance;
- Provides an
excellent paint base.
Stainless Steel Only
- Best for ESD; has a
high resistivity;
- Less costly than
Copper.
Stainless Steel/Copper
- Best for ESD and
EMI/RFI combined.
Copper Only
- Provide
low-impedance conductive coating.
Aluminum Only
- Reflective coatings
and cost-effective conductive coating.
Other Metals or Alloys, as requested
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